Toshiba Ships Samples of Industry's First Universal Flash Storage Devices
Back to the Article
by BWW News Desk
Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry , the new module is fully compliant with the JEDEC UFS  Ver.1.1 standard , and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.
With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module.
Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its lineup, according to market demand.
For embedded NAND flash memory modules. Source: Toshiba, as of February 2013.